Lens Packaging of InP Feed using 2-D Antenna Simulation
In this HM-1904 process, an on-chip dual-slot antenna feed and its lens antenna packaging are designed. H-band power detector circuit using the Teledyne 250 nm InP DHBT device is integrated to test the performance of the feed and lens antenna. Dimensions of dual-slot antenna and lens are meticulously designed with HFSS using a 2-D antenna pattern simulation method. The 2-D method can simplify the simulation with a low resource and provide reliable results on both E-plane and H-plane of the antenna. The goal of the feed antenna is to provide a circular beam pattern to the attached lens. With the HFSS 2-D method designed on-chip feed, both primary and secondary pattern showed an equal E-plane and H-plane beamwidth. The future purpose of this chip is matching the simulated results with pattern measurement and eventually calculating the packaging loss of the integrated circuit in the lens packaged system. Once the packaging loss is defined, alternate circuits such as oscillators or mixers could also be integrated using the same design.