Lens Packaging of InP Feed using 2-D Antenna Simulation

  • Jun Sung Kim Korea University
  • Kyoung Min Lee Korea University
  • Moon Il Kim Korea University
DOI: https://doi.org/10.23075/jicas.2022.8.2.007
Keywords: Dual-Slot Antenna, Hyper-hemispheric Lens, Lens Antenna, Radiation Pattern, Terahertz Antenna

Abstract

In this HM-1904 process, an on-chip dual-slot antenna feed and its lens antenna packaging are designed. H-band power detector circuit using the Teledyne 250 nm InP DHBT device is integrated to test the performance of the feed and lens antenna. Dimensions of dual-slot antenna and lens are meticulously designed with HFSS using a 2-D antenna pattern simulation method. The 2-D method can simplify the simulation with a low resource and provide reliable results on both E-plane and H-plane of the antenna. The goal of the feed antenna is to provide a circular beam pattern to the attached lens. With the HFSS 2-D method designed on-chip feed, both primary and secondary pattern showed an equal E-plane and H-plane beamwidth. The future purpose of this chip is matching the simulated results with pattern measurement and eventually calculating the packaging loss of the integrated circuit in the lens packaged system. Once the packaging loss is defined, alternate circuits such as oscillators or mixers could also be integrated using the same design.

Author Biographies

Jun Sung Kim, Korea University

Jun Sung Kim received the B.S. in electrical engineering from Korea University, Seoul, Korea, in 2020. His research interest includes lens and waveguide packaging of RF circuits for wireless communications.

Kyoung Min Lee, Korea University

Kyoung Min Lee received the B.S. in electrical engineering from Korea University, Seoul, Korea, in 2015. His research interest includes millimeter wave antenna and circuit design for wireless communications.

Moon Il Kim, Korea University

Moon Il Kim received the Ph.D degree from the California Institute of Technology, Pasadena, CA, USA, in 1993. He has been a member of the Faculty of Electrical Engineering, Korea University, Seoul, South Korea, since 2000. He was a member of Technical Staff with the Submillimeter-Wave Advanced Technology Group, Jet Propulsion Laboratory, until 1998, and a Senior Scientist with the Microwave Group, Rockwell Science Center (currently Teledyne Scientific) until 2000. His current research interests include development of both passive and active circuit components required in construction of terahertz communication and imaging systems.

Homepage : http://thomas.korea.ac.kr/

Published
2022-04-01
How to Cite
Kim, J. S., Lee, K. M., & Kim, M. I. (2022). Lens Packaging of InP Feed using 2-D Antenna Simulation. Journal of Integrated Circuits and Systems, 8(2). https://doi.org/10.23075/jicas.2022.8.2.007
Issue
Vol 8 No 2 (2022)
Section
Articles